Title:
ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/107505
Kind Code:
A1
Abstract:
This manufacturing method of an electronic device 1 involves: a bonding step S09 in which a belt-shape sealing member 11 extending in one direction is bonded along the one direction such that part of each of a first electrode layer 5 and a second electrode layer 9 in each electronic device unit 10 is exposed and straddles multiple electronic device units 10; an incision step S05 in which, prior to the bonding step S09, an incision the width of the sealing member 11 is made in a sealing body 20, which is the base material of the sealing member 11 and has a larger dimension in the width direction, perpendicular to the aforementioned one direction, than the sealing member 11; and a separation step S08 in which, after the incision step S05 and before the bonding step S09, the sealing member 11 is separated from the sealing body 20 in which the incision has been made. In the bonding step S09, the sealing member 11, separated from the sealing body 20 in the separation step S08, is bonded.
Inventors:
MORISHIMA SHINICHI (JP)
SHIMOGAWARA MASAYA (JP)
FUJII TAKASHI (JP)
SHIMOGAWARA MASAYA (JP)
FUJII TAKASHI (JP)
Application Number:
PCT/JP2018/044031
Publication Date:
June 06, 2019
Filing Date:
November 29, 2018
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
H05B33/10; B26D3/08; H01L51/50; H05B33/02; H05B33/04
Domestic Patent References:
| WO2017154575A1 | 2017-09-14 | |||
| WO2010090223A1 | 2010-08-12 | |||
| WO2017057241A1 | 2017-04-06 |
Foreign References:
| JP2012200824A | 2012-10-22 | |||
| US20050227387A1 | 2005-10-13 | |||
| JP2008269964A | 2008-11-06 |
Other References:
See also references of EP 3720250A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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