Title:
ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/184199
Kind Code:
A1
Abstract:
An electronic device manufacturing method comprising at least: a preparation step for preparing a structure (100) comprising an adhesive film (50) that is provided with a base layer (10), an adhesive resin layer (A) provided to a first surface (10A) side of the base layer (10) and for temporarily fixing an electronic component (70), and an adhesive resin layer (B) provided to a second surface (10B) side of the base layer (10) and having an adhesive force that decreases in response to an external stimulus, the electronic component (70) that is adhered to the adhesive resin layer (A) of the adhesive film (50), and a support substrate (80) that is adhered to the adhesive resin layer (B) of the adhesive film (50); a prebake step for heating the structure (100); and a sealing step for sealing the electronic component (70) by means of a sealing material (60).
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Inventors:
MIURA TORU (JP)
KURIHARA HIROYOSHI (JP)
KURIHARA HIROYOSHI (JP)
Application Number:
PCT/JP2020/008007
Publication Date:
September 17, 2020
Filing Date:
February 27, 2020
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
H01L23/12; C09J7/38; C09J123/00; C09J125/04; C09J133/00; C09J175/04; C09J183/04; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
| WO2018135546A1 | 2018-07-26 | |||
| WO2017170452A1 | 2017-10-05 |
Foreign References:
| JP2018157037A | 2018-10-04 | |||
| JP2011134811A | 2011-07-07 | |||
| JP2015126121A | 2015-07-06 | |||
| JP2011134811A | 2011-07-07 | |||
| JP2019046792A | 2019-03-22 |
Other References:
MITSUI CHEMICALS, INC., ORESTAR P49-75S
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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