Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING MIDDLE FRAME
Document Type and Number:
WIPO Patent Application WO/2023/005303
Kind Code:
A1
Abstract:
An electronic device comprising a middle frame, the middle frame comprising a side frame (1) and a middle plate (2). The side frame (1) is disposed surrounding an edge of the middle plate (2). The middle plate (2) is provided with multiple welding columns (21). The side frame (1) is provided with multiple through holes (11) corresponding to the positions and sizes of the welding columns (21), the welding columns (21) corresponding one-to-one to the through holes (11) to form a hole axis fit. The surfaces of the multiple welding columns (21) and the surfaces of the through holes (11) are both rough surfaces. The side frame (1) and the middle plate (2) are bonded by means of laser welding at the fitting positions of the welding columns (21) and the through holes (11), the rough surfaces being used increase the laser absorption amount at the fitting positions of the welding columns (21) and the through holes (11) during laser welding. By means of configuring a rough surface, the absorption of the welding laser is effectively increased, thereby increasing weld quality. Also provided is a method for manufacturing the middle frame.
Inventors:
ZHANG CHUNXIAO (CN)
Application Number:
PCT/CN2022/089551
Publication Date:
February 02, 2023
Filing Date:
April 27, 2022
Export Citation:
Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
H04M1/02; B23K31/00
Foreign References:
| CN106862399A | 2017-06-20 | |||
| CN209312884U | 2019-08-27 | |||
| US20210105905A1 | 2021-04-08 | |||
| CN109151101A | 2019-01-04 | |||
| CN108188287A | 2018-06-22 | |||
| CN102861990A | 2013-01-09 | |||
| CN209120231U | 2019-07-16 | |||
| CN202110869182A | 2021-07-29 |
Other References:
See also references of EP 4149096A4
Attorney, Agent or Firm:
CHINABLE IP (CN)
Download PDF: