Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/179394
Kind Code:
A1
Abstract:
An electronic device which is provided with: an electronic component (12); a first member (19) at least a part of which is arranged within a sealing resin body; and second members (16, 25) which are connected with the first member, with solders (21, 22) being interposed therebetween, within the sealing resin body (11). The first member comprises: a base (191c) that is formed using a metal material; and a coating film (191d) that is provided on at least a back surface (191b)-side surface among the surfaces of the base, said back surface (191b) being on the reverse side of a facing surface (191a) of the first member, said facing surface facing the second members. The coating film comprises: a metal thin film (191e) that is formed on the surface of the base; and a recessed and projected oxide film (191f) that is formed, on the metal thin film, from an oxide of a metal which is the same as the metal that is the main component of the metal thin film. The recessed and projected oxide film is arranged so as to overlap at least the whole of a connection region (194) of the facing surface of the first member, in said connection region the solders being connected, in the back surface of the first member when perspectively viewed from the lamination direction of the first member, the solders and the second members.
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Inventors:
OOSHIMA MASANORI (JP)
HAYASHI EIJI (JP)
HAYASHI EIJI (JP)
Application Number:
PCT/JP2017/011948
Publication Date:
October 19, 2017
Filing Date:
March 24, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/48; G01N29/04; H01L23/28; H01L23/29; H01L23/50; H01L25/07; H01L25/18
Foreign References:
| JP2016004941A | 2016-01-12 | |||
| JPH03222465A | 1991-10-01 | |||
| JP2009182159A | 2009-08-13 | |||
| JP2013247256A | 2013-12-09 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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