ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND SUBSTRATE LAMINATE

Title:

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND SUBSTRATE LAMINATE

Document Type and Number:

WIPO Patent Application WO/2017/141285

Kind Code:

A1

Abstract:

Provided are: an electronic device which is able to be prevented from defects due to bleeding of an ultraviolet curable resin; a method for bonding an electronic device; and a substrate laminate. An electronic device (100) according to one embodiment of the present technique is provided with a light-transmitting substrate (10), a display panel (20), a first bonding layer (41) and a regulation part (60). The light-transmitting substrate has a first surface (11), a second surface (12) that is on the reverse side of the first surface, and a frame-like coating film (13) that is provided on the peripheral part of the first surface. The display panel has a display surface (21) that faces the first surface. The first bonding layer is formed of a cured product of a photocurable resin, which joins the first surface and the display surface with each other and covers the inner peripheral part of the coating film. The regulation part is formed on the coating film along at least a part of the peripheral part of the first bonding layer, and has a structural surface (61) that has a lower wettability with the photocurable resin than the coating film.

Inventors:

SUGIYAMA KOICHI (JP)
KONNO AKIHIRO (CN)
ZENG FEI (CN)

Application Number:

PCT/JP2016/000788

Publication Date:

August 24, 2017

Filing Date:

February 16, 2016

Export Citation:

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Assignee:

SONY CORP (JP)

International Classes:

G09F9/00; G02F1/1333

Foreign References:

JP2014223759A	2014-12-04
JP2014182163A	2014-09-29
JP2009069321A	2009-04-02
JP2015126347A	2015-07-06
JP2013195806A	2013-09-30
JP2015232656A	2015-12-24
JP2016038559A	2016-03-22
JP2013257480A	2013-12-26
JP2011209590A	2011-10-20

Other References: