Title:
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/152961
Kind Code:
A1
Abstract:
A quantum computing device (10) includes: a first substrate (30) having a circuit element; and a second substrate (40) that is layered on the first substrate (30) and that covers the circuit element. The second substrate (40) has bumps (42) each including: a tapered protruding section (44) that is formed of a base material (43) of the second substrate (40) and that has a cross section the area of which gradually decreases towards the leading end, said cross section intersecting the direction in which the first substrate (30) and the second substrate (40) are layered; and tapered conductive films (45A, 45B) that cover the surface of the protruding section (44) and that reflect the shape of the protruding section (44). The bumps (42) are bonded to the first substrate (30).
Inventors:
TAKENOUCHI MASATOSHI (JP)
KOUMA NORINAO (JP)
SHIMANOUCHI TAKEAKI (JP)
TAKAHASHI TSUYOSHI (JP)
KOUMA NORINAO (JP)
SHIMANOUCHI TAKEAKI (JP)
TAKAHASHI TSUYOSHI (JP)
Application Number:
PCT/JP2022/005649
Publication Date:
August 17, 2023
Filing Date:
February 14, 2022
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
G06N10/00
Domestic Patent References:
| WO2005097396A1 | 2005-10-20 | |||
| WO2020169418A1 | 2020-08-27 |
Foreign References:
| JP2009231721A | 2009-10-08 | |||
| JP2000306952A | 2000-11-02 | |||
| JP2003204162A | 2003-07-18 | |||
| JPH11163204A | 1999-06-18 |
Attorney, Agent or Firm:
NAKAJIMA, Jun et al. (JP)
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