ELECTRONIC DEVICE PACKAGE AND SEALING SHEET

Title:

ELECTRONIC DEVICE PACKAGE AND SEALING SHEET

Document Type and Number:

WIPO Patent Application WO/2016/092964

Kind Code:

A1

Abstract:

An electronic device package which is provided with a body to be sealed and a sealing layer that seals the body to be sealed. The body to be sealed has a portion that is not in contact with the sealing layer at least in a part of the upper surface or the lateral surface of the body to be sealed.

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Inventors:

ISHII JUN (JP)
SHIGA GOJI (JP)
ISHIZAKA TSUYOSHI (JP)
IINO CHIE (JP)

Application Number:

PCT/JP2015/080420

Publication Date:

June 16, 2016

Filing Date:

October 28, 2015

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)

International Classes:

H01L23/04; H01L23/28; H03H9/25

Domestic Patent References:

WO2014024786A1

2014-02-13

Foreign References:

JP2004255487A	2004-09-16
JP2014183096A	2014-09-29

Attorney, Agent or Firm:

UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)

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