ELECTRONIC DEVICE

WIPO Patent Application WO/2011/158873

A1

Disclosed is an electronic device capable of suppressing the occurring of cracks or breaks in glass substrates or a sealing layer when laser-sealing two glass substrates together. An electronic device (1) is provided with a first glass substrate (2), a second glass substrate (3), and a sealing layer (6) formed between these. The sealing layer (6) comprises a molten anchoring layer of a sealing material containing a sealing glass, a low expansion filler material and a laser absorption material. From a cross section view of the sealing layer (6), the sum of the perimeter lengths of the low-expansion filler material and the laser absorption material per unit surface area (the liquid inhibition value) is 0.7-1.3μm-1, and the sum of the sealing glass heat expansion coefficient multiplied by the sealing glass surface area ratio and of the low-expansion filler material heat expansion coefficient multiplied by the sum of the surface area ratios of the low-expansion filler material and the laser absorption material (the heat expansion value), is 50-90x10-7/C.

YAMADA KAZUO (JP)
ONO MOTOSHI (JP)
WATANABE MITSURU (JP)
TAKEUCHI TOSHIHIRO (JP)
TAKEDA SATOSHI (JP)

PCT/JP2011/063717

December 22, 2011

June 15, 2011

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ASAHI GLASS CO LTD (JP)
YAMADA KAZUO (JP)
ONO MOTOSHI (JP)
WATANABE MITSURU (JP)
TAKEUCHI TOSHIHIRO (JP)
TAKEDA SATOSHI (JP)

C03C27/06; C03C8/24; G02F1/1339; H01J9/26; H01J11/02; H01J29/86; H05B33/04

WO2010061853A1	2010-06-03
WO2010055888A1	2010-05-20

JP2006524419A

2006-10-26

SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)

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