ELECTRONIC DEVICE

WIPO Patent Application WO/2016/139890

A1

In the present invention, an electronic device is provided with a heat generating element (1), an insulative metal-member (3, 3a, 4, 4a, 5, 5a-5d), and a sealing member (8) which seals the heat generating element and the insulative metal-member. The insulative metal-member is formed by stacking a first metal part (3, 3a) on which the heat generating element is mounted, a second metal part (5, 5a-5d) a portion of which is exposed from the sealing member, and an insulative part (4, 4a) which is sandwiched between the first metal part and the second metal part. The second metal part includes a center section (51, 51a-51d) and a peripheral section (52, 52a-52d) which is a portion that surrounds the center section, the thickness of which is thinner than the center section, and which is sealed by the sealing member. The second metal part includes one surface (S1) that faces and is in close contact with the insulative part, and an exposed surface (S2) which is a region of the surface opposite the one surface, and which corresponds to the center section and is exposed from the sealing member. The second metal part includes, at the periphery of the center section, a portion that is recessed more than a virtual line (P1) which connects the end of the one surface and the end of the exposed surface in the shortest possible distance.

JP3483238	FILM CARRIER AND FILM CARRIER DEVICE USING THE SAME
WO/2022/209609	SEMICONDUCTOR DEVICE
JP2019021856	MODULE

HIRAMITSU SHINJI (JP)

PCT/JP2016/000632

September 09, 2016

February 08, 2016

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DENSO CORP (JP)

H01L23/29

JP2014154613A	2014-08-25
JPH05299528A	1993-11-12
JPH06120374A	1994-04-28
JP2005057126A	2005-03-03

KIN, Junhi (JP)
Gold Junki (JP)

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