Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/000880
Kind Code:
A1
Abstract:
The present application provides an electronic device, comprising: a circuit board, on which an electronic heating element is arranged; a shielding frame, which is mounted on the circuit board and surrounds a sidewall surface of the electronic heating element, and an opening is formed in the shielding frame; a heat dissipation member, which is arranged above the opening, the heat dissipation member is connected to the electronic heating element sequentially through a first elastic heat conducting layer, a first ultra-thin conductive layer and a second elastic heat conducting layer, and the first elastic heat conducting layer and the second elastic heat conducting layer are in a compressed state; the area of the first ultra-thin conductive layer is greater than or equal to the area of the opening, the first ultra-thin conductive layer is electrically connected with the shielding frame, and the shielding frame, the first ultra-thin conductive layer and the circuit board form an electromagnetic shielding cavity for accommodating the electronic heating element. The electronic device of the present application can enhance the heat dissipation capability of the electronic heating element while ensuring the shielding effect on the electronic heating element.
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Inventors:
DU BAI (CN)
YU XUEQUAN (CN)
LI DELIANG (CN)
YU XUEQUAN (CN)
LI DELIANG (CN)
Application Number:
PCT/CN2020/099630
Publication Date:
January 07, 2021
Filing Date:
July 01, 2020
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20; H05K9/00
Foreign References:
| CN110325019A | 2019-10-11 | |||
| CN206181696U | 2017-05-17 | |||
| CN102159052A | 2011-08-17 | |||
| CN207185099U | 2018-04-03 | |||
| CN105828571A | 2016-08-03 | |||
| CN107546197A | 2018-01-05 | |||
| US20170220074A1 | 2017-08-03 |
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