Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/205491
Kind Code:
A1
Abstract:
A casing (10) which accommodates a substrate (21) on which an electronic component is mounted has a structure in which a casing body part (11) covering a rear surface side of the substrate (21), and a casing lid part (12) covering one main surface side of the substrate (21) are overlapped. A planar shape of a superimposed region at which the casing body part (11) of the casing (10) and the casing lid part (12) overlap is a shape in which a casing base part (10a) that extends longitudinally and vertically, and protruding parts (10b) that partially project outward from the casing base part (10a) are provided so as to be continuous. With the casing 10 forming a U-shape, a recessed section (1a) is provided between the two protruding parts (10b), which are separate from each other and project in parallel from the casing base part (10a).
Inventors:
KUWAHARA ERI (JP)
KATAYAMA MASAHIKO (JP)
KATAYAMA MASAHIKO (JP)
Application Number:
PCT/JP2020/015446
Publication Date:
October 14, 2021
Filing Date:
April 06, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01S7/03
Domestic Patent References:
| WO1994018720A1 | 1994-08-18 |
Foreign References:
| JPH10320514A | 1998-12-04 | |||
| US20120280856A1 | 2012-11-08 | |||
| JPH02266285A | 1990-10-31 |
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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