Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/206122
Kind Code:
A1
Abstract:
The present invention is provided with a component mounting part (20), an electronic component (60), solder that is disposed between the component mounting part (20) and the electronic component (60), and a member (10) for mounting that is mounted on a housing. The present invention is further provided with a support beam (40) that connects the component mounting part (20) and the member (10) for mounting and that supports the component mounting part (20) on the member (10) for mounting.
Inventors:
ITO KEITARO (JP)
AKASHI TERUHISA (JP)
FUNABASHI HIROFUMI (JP)
AKASHI TERUHISA (JP)
FUNABASHI HIROFUMI (JP)
Application Number:
PCT/JP2021/014762
Publication Date:
October 14, 2021
Filing Date:
April 07, 2021
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/12; H01L21/60; H05K1/02
Domestic Patent References:
| WO2016084630A1 | 2016-06-02 |
Foreign References:
| JP2012039033A | 2012-02-23 | |||
| JPS6057152U | 1985-04-20 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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