Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/215187
Kind Code:
A1
Abstract:
An electronic device (1) comprises: a printed circuit board (2), a plurality of electronic components (3-5) that is mounted on the printed circuit board and has different heights; a lid (6) that is configured of a metal material, covers the plurality of electronic components, and is grounded with respect to the printed circuit board; a first heat radiating member (16) provided between the lid and at least one electronic component from which heat is to be radiated from among the plurality of electronic components; a heat sink (7) provided above the lid; and a second heat radiating member (19) provided between the lid and the heat sink. The upper surface of the lid is shaped to have a step according to the height of the plurality of electronic components.
Inventors:
ISHIKAWA TAKESHI (JP)
Application Number:
PCT/JP2021/012596
Publication Date:
October 28, 2021
Filing Date:
March 25, 2021
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/00; H01L23/40; H05K1/02; H05K7/20; H05K9/00
Domestic Patent References:
| WO1995028073A1 | 1995-10-19 |
Foreign References:
| JP2017135368A | 2017-08-03 | |||
| US20130329356A1 | 2013-12-12 | |||
| JP2012164852A | 2012-08-30 | |||
| JP2007059535A | 2007-03-08 |
Attorney, Agent or Firm:
SATO INTERNATIONAL PATENT FIRM (JP)
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