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Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/038691
Kind Code:
A1
Abstract:
Provided is an electronic device making it possible to: while reducing the number of parts, arrange, with accurate positioning, a coil and an external connection terminal on a deformable substrate where a metal wiring pattern has been formed; and achieve a smaller thickness overall.　The invention is provided with: a substrate that comprises a synthetic resin material and is deformable; a metal wiring pattern disposed on the substrate; a coil comprising a wire material that is electrically bonded by a bonding means to the metal wiring pattern and transmits power contactlessly by a magnetic field resonance scheme or an electromagnetic induction scheme; an external connection terminal for electrically connecting the metal wiring pattern and an external element that is electrically bonded and is provided to the exterior of the substrate; and a resin layer for covering the coil.

Inventors:
SUGIMOTO MASAAKI (JP)
YOKOYAMA HIDEAKI (JP)
OITA YUICHI (JP)
FUJIMAKI KIYOSHI (JP)
Application Number:
PCT/JP2020/031177
Publication Date:
February 24, 2022
Filing Date:
August 18, 2020
Export Citation:
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Assignee:
ELEPHANTECH INC (JP)
TAKAHATA PREC CO LTD (JP)
International Classes:
H01F38/14
Foreign References:
JP2007317914A2007-12-06
JP6738077B12020-08-12
JP2010067773A2010-03-25
JP2011210937A2011-10-20
JPH09260156A1997-10-03
JP2006228806A2006-08-31
JP2012213270A2012-11-01
JP2010028969A2010-02-04
JP2012199370A2012-10-18
JP2010016985A2010-01-21
JP2012110135A2012-06-07
JP2019155916A2019-09-19
JP2011216621A2011-10-27
JP2007134473A2007-05-31
Attorney, Agent or Firm:
SEZAKI Yukinori (JP)
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