Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/255736
Kind Code:
A1
Abstract:
The present invention relates to an electronic device and, particularly, to an electronic device comprising: a printed circuit board having a heat-generating element arranged on one surface thereof; and a heat transfer coin provided such that one surface thereof comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated in the heat-generating element. Accordingly, the present invention provides an advantage of enhancing heat dissipation performance without increasing the thickness of the printed circuit board.
Inventors:
JEONG BAE MOOK (KR)
JI KYO SUNG (KR)
AHN SEONG MIN (KR)
RYU CHI BACK (KR)
KIM JAE EUN (KR)
LEE SEUNG MIN (KR)
PARK KI HUN (KR)
PARK WON JUN (KR)
YANG JUN WOO (KR)
JI KYO SUNG (KR)
AHN SEONG MIN (KR)
RYU CHI BACK (KR)
KIM JAE EUN (KR)
LEE SEUNG MIN (KR)
PARK KI HUN (KR)
PARK WON JUN (KR)
YANG JUN WOO (KR)
Application Number:
PCT/KR2022/007554
Publication Date:
December 08, 2022
Filing Date:
May 27, 2022
Export Citation:
Assignee:
KMW INC (KR)
International Classes:
H05K1/02; H05K7/20
Foreign References:
| KR20200049620A | 2020-05-08 | |||
| US20140137410A1 | 2014-05-22 | |||
| CN112399772A | 2021-02-23 | |||
| KR20210033923A | 2021-03-29 | |||
| JP4469101B2 | 2010-05-26 |
Attorney, Agent or Firm:
SUAN INTELLECTUAL PROPERTY (KR)
Download PDF: