Title:
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2018/199022
Kind Code:
A1
Abstract:
An electronic element mounting substrate comprising: a rectangular substrate having a first major surface and a second major surface opposing the first major surface; and heat-dissipation bodies which are embedded in a row in the substrate, the heat-dissipation bodies being made from a carbon material and having a third major surface positioned on the first major surface side in a thickness direction and a fourth major surface opposing the third major surface. In a transparent plan view, the heat-dissipation bodies are more thermally conductive in a direction perpendicular to a direction of the row of the heat-dissipation bodies than in the direction of the row of the heat-dissipation bodies.
Inventors:
KITAZUMI NOBORU (JP)
Application Number:
PCT/JP2018/016457
Publication Date:
November 01, 2018
Filing Date:
April 23, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/12; H05K1/02; H01L23/36; H01L33/64
Foreign References:
| JP2016157928A | 2016-09-01 | |||
| US20110157868A1 | 2011-06-30 | |||
| JP2011159662A | 2011-08-18 | |||
| JP2013175508A | 2013-09-05 |
Other References:
See also references of EP 3618583A4
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