Title:
ELECTRONIC MODULE REPAIRING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/119118
Kind Code:
A1
Abstract:
Disclosed is an electronic module repairing method for repairing a failed electronic module. The electronic module repairing method comprises the following steps: fixedly connecting a suction device with a second bottom plate, so that when soldering tin between the suction device and the second bottom plate is in a molten state, the suction device and the second bottom plate are still fixed as a whole; performing heating treatment on an electronic module, so that the soldering tin between the electronic module and a first bottom plate is melted; and a repairing machine drawing up the surface of the suction device of the electronic module, and dismantling the electronic module from the first bottom plate so as to facilitate repairing or replacing the electronic module. According to the electronic module repairing method provided in the present invention, since a suction device of an electronic module and a second bottom plate are fixed in a heating state, even if a welding point between the suction device and the second bottom plate is melted in a high temperature state, the suction device of the electronic module and the second bottom plate can still be maintained as a complete whole, thereby ensuring that the electronic module is wholly dismantled.
Inventors:
XUE FEI (CN)
MA FUQIANG (CN)
DING HAIXING (CN)
CHEN XIAOCHEN (CN)
MA FUQIANG (CN)
DING HAIXING (CN)
CHEN XIAOCHEN (CN)
Application Number:
PCT/CN2015/071612
Publication Date:
August 04, 2016
Filing Date:
January 27, 2015
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K3/32; B23K1/018; B23K3/00
Foreign References:
| CN1750750A | 2006-03-22 | |||
| CN104080323A | 2014-10-01 | |||
| CN1501433A | 2004-06-02 | |||
| CN2521874Y | 2002-11-20 | |||
| CN104227168A | 2014-12-24 |
Attorney, Agent or Firm:
GUANGZHOU SCIHEAD PATENT AGENT CO.. LTD (CN)
广州三环专利代理有限公司 (CN)
广州三环专利代理有限公司 (CN)
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