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Patent Searching and Data


Title:
ELECTROPLATED PART AND MANUFACTURING METHOD THEREFOR, FIXTURE FOR MANUFACTURING, AND APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/022535
Kind Code:
A1
Abstract:
An electroplated part, which contains hardly any organic residues and has a uniform electroplated layer. An electroplating method for manufacturing the electroplated part is also provided. By means of controlling the ratio of the length of a trajectory of motion of the electroplated part relative to an anode during the electroplating process to the width of the anode, and adding an auxiliary cathode to the electroplated part, the electroplating method improves the uniformity of the thickness of the electroplated layer at various portions of the electroplated part. A fixture for implementing the electroplating method and an electroplating apparatus are provided. The electroplated layer of the electroplated part prepared by means of the electroplating method has relatively uniform thickness and a high coverage rate, problems such as burn and breakage have hardly occurred during the electroplating process of the electroplated part, the yield of electroplated parts being high and the rejection rate being low, and in addition, the precision of the weight of plated layers of electroplated parts can reach 99% or above.

Inventors:
LIU ZIQIANG (CN)
ZHANG DEYUAN (CN)
ZHANG GUI (CN)
Application Number:
PCT/CN2023/110250
Publication Date:
February 01, 2024
Filing Date:
July 31, 2023
Export Citation:
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Assignee:
BIOTYX MEDICAL SHENZHEN CO LTD (CN)
International Classes:
C25D15/02; C25D7/00; C25D13/02; C25D17/06; C25D17/08; C25D19/00
Foreign References:
EP0633329A11995-01-11
KR20150087502A2015-07-30
JP2001040498A2001-02-13
JPH07108644A1995-04-25
CN210458402U2020-05-05
Attorney, Agent or Firm:
BEIJING CHENQUAN INTELLECTUAL PROPERTY LAW FIRM (CN)
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