Title:
ELECTROPLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/120158
Kind Code:
A2
Abstract:
The present invention relates to an electroplating apparatus which comprises: a plating vessel containing electrolyte solution; and a supply unit which is connected to the plating vessel and which sprays the electrolyte solution containing metallic ions for electroplating onto specific parts of the object to be plated, wherein said supply unit is connected to an anode, and the object to be plated is connected to a cathode.
Inventors:
KIM DUK-YONG (KR)
KIM SANG-YONG (KR)
SEO BONG-WON (KR)
KIM SANG-YONG (KR)
SEO BONG-WON (KR)
Application Number:
PCT/KR2010/002425
Publication Date:
October 21, 2010
Filing Date:
April 19, 2010
Export Citation:
Assignee:
KMW INC (KR)
KIM DUK-YONG (KR)
KIM SANG-YONG (KR)
SEO BONG-WON (KR)
KIM DUK-YONG (KR)
KIM SANG-YONG (KR)
SEO BONG-WON (KR)
International Classes:
C25D5/02; C25D17/00; C25D17/06; C25D17/10; C25D21/06
Foreign References:
| KR19980014624A | ||||
| JP2000096282A | 2000-04-04 | |||
| JPH08296093A | 1996-11-12 | |||
| JP2008038240A | 2008-02-21 |
Attorney, Agent or Firm:
LEE, Keon-Joo (KR)
이건주 (KR)
이건주 (KR)
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