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Title:
ELECTROPLATING SOLUTION FOR TIN OR TIN ALLOY, AND USE FOR SAME
Document Type and Number:
WIPO Patent Application WO/2014/208204
Kind Code:
A1
Abstract:
　The present invention addresses the problem that attempts to fill a via- or a through-hole using a conventional plating solution for tin or tin alloy plating are either unsatisfactory or, even when successful, extremely time-consuming. An electroplating solution for tin or a tin alloy for addressing this problem is characterized in containing the following components: (a) a carboxyl-group-containing compound; and (b) a carbonyl-group-containing compound, the amounts contained in the electroplating solution being 1.3 g/L or greater for component (a) and 0.3 g/L or greater for component (b).

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Inventors:
HORI MASAO (JP)
Application Number:
PCT/JP2014/062367
Publication Date:
December 31, 2014
Filing Date:
May 08, 2014
Export Citation:
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Assignee:
JCU CORP (JP)
International Classes:
C25D3/32; C25D3/60; C25D7/00; C25D7/12
Foreign References:
JP2001089894A2001-04-03
JP2001011687A2001-01-16
JP2007284733A2007-11-01
JP2001098396A2001-04-10
JP2012087393A2012-05-10
JP2004193520A2004-07-08
Attorney, Agent or Firm:
The Patent Corporate body of Ono & Co. (JP)
Patent business corporation Ono international patent firm (JP)
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