Title:
ELECTROSPUN FILM, AND MANUFACTURING METHOD THEREFOR AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/179007
Kind Code:
A1
Abstract:
An enhanced PVDF electrospun film, which is prepared from polyvinylidene fluoride and at least one low-melting-point polymer having a melting point lower than that of polyvinylidene fluoride at a weight ratio of 99.9:0.1 to 90:10, wherein the softening point of the low-melting-point polymer is in the range of 110-140ºC. The enhanced electrospun film has good mechanical properties, a higher water vapor transmission rate, and hydrostatic pressure resistance. Further provided are a manufacturing method for the enhanced PVDF electrospun film and the use of the enhanced PVDF electrospun film in the preparation of a waterproof and moisture-permeable product.
Inventors:
HU JINLIAN (CN)
SHI SHUO (CN)
SI YIFAN (CN)
WONG SIU WAH (CN)
YUEN MUK FUNG (CN)
SHI SHUO (CN)
SI YIFAN (CN)
WONG SIU WAH (CN)
YUEN MUK FUNG (CN)
Application Number:
PCT/CN2022/126507
Publication Date:
September 28, 2023
Filing Date:
October 20, 2022
Export Citation:
Assignee:
NANODOCKS TECH LIMITED (CN)
UNIV CITY HONG KONG (CN)
UNIV CITY HONG KONG (CN)
International Classes:
D04H1/728; D01F8/06; D01F8/16
Foreign References:
| CN112160072A | 2021-01-01 | |||
| CN103469488A | 2013-12-25 | |||
| JP2009245639A | 2009-10-22 | |||
| CN103437071A | 2013-12-11 |
Attorney, Agent or Firm:
XU&PARTNERS, LLC. (CN)
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