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Patent Searching and Data


Title:
ELECTROSTATIC ATTRACTION DEVICE AND ELECTROSTATIC ATTRACTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/022180
Kind Code:
A1
Abstract:
The present invention maintains an in-plane stress, which occurs at an interface between an attracting surface and an object, in an optimum state, and significantly improves the attraction force and weight capacity of an electrostatic chuck. An electrostatic attraction module of the present invention comprises a distal end member having a bipolar-type attracting surface, and a support member supporting the distal end member. The distal end member as a whole is elastically displaceable in directions of moving away from and moving toward an object to be attracted, and the distal end member and the support member are coupled through a rotatable joint. An electrostatic attraction device comprises a distal end member having a plurality of bipolar-type attracting surfaces that are elastically displaceable in directions of moving away from and moving toward an object to be attracted. A support member that supports the distal end member extends from a base, and the base is deformable. Also provided is an electrostatic attraction method for attracting and holding an object to be attracted, using the electrostatic attraction module or the electrostatic attraction device.

Inventors:
SAITO SHIGEKI (JP)
RYO TOMOHIRO (JP)
TAOKA YUKI (JP)
XU SANCHUAN (JP)
Application Number:
PCT/JP2022/031126
Publication Date:
February 23, 2023
Filing Date:
August 17, 2022
Export Citation:
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Assignee:
TOKYO INST TECH (JP)
International Classes:
H02N13/00; B25J15/06
Foreign References:
JP2001353682A2001-12-25
KR101019111B12011-03-09
JP2011099797A2011-05-19
JPH10316354A1998-12-02
JP2013519532A2013-05-30
JPS6314207A1988-01-21
JPS5898827U1983-07-05
JP6846821B22021-03-24
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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