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Title:
ELECTROSTATIC CHUCK
Document Type and Number:
WIPO Patent Application WO/2023/286812
Kind Code:
A1
Abstract:
This electrostatic chuck comprises a chuck member, a base member, and a bonding material. The bonding material is positioned between the chuck member and the base member. The bonding material contains a polyimide. The bonding material has a gap in a middle section that is at a distance from the chuck member and the base member.

Inventors:
MUNEISHI TAKESHI (JP)
GODA HIDEKI (JP)
Application Number:
PCT/JP2022/027603
Publication Date:
January 19, 2023
Filing Date:
July 13, 2022
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H02N13/00; H01L21/683
Foreign References:
JP2021072386A2021-05-06
JPH09213773A1997-08-15
JP2013187477A2013-09-19
JP2006187110A2006-07-13
JP2001338970A2001-12-07
JP2016103560A2016-06-02
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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