ELECTROSTATIC CLAMPLESS HOLDER MODULE AND COOLING SYSTEM

WIPO Patent Application WO/2003/049180

A1

An electrostatic clampless holder module having an alumina electrostatic holding plate and a cooling late connected with each other, wherein the cooling plate is made of a Cu based composite material which contains Cu and Ni both having a great thermal expansion coefficient and W and Mo both having a small thermal expansion coefficient in a composition ratio suitable for providing a high thermally conductive material having almost the same thermal expansion coefficient as that of an alumina material for the electrostatic holding plate, and has been subjected to forging to an extent sufficient to prevent the penetration leak of air or the like, and is coated with a Ni, Cr or Cu thin film having corrosion resistance in water by means of metal plating, sputtering, or the like.

JP2709639

[Title of Invention] Heater device with cooler

TATENO NORIAKI (JP)
MIYAJI JUN (JP)
SAGO YASUMI (JP)
IKEDA MASAYOSHI (JP)
KANEKO KAZUAKI (JP)
TAKAMURA TOMIO (JP)
HIRAYAMA TADASHI (JP)
IKEMURA YOSHIYUKI (JP)
TAMARU MASAHIKO (JP)

PCT/JP2002/012658

June 12, 2003

December 03, 2002

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TOTO LTD (JP)
ANELVA CORP (JP)
CHOSHU INDUSTRY CO LTD (JP)
TATENO NORIAKI (JP)
MIYAJI JUN (JP)
SAGO YASUMI (JP)
IKEDA MASAYOSHI (JP)
KANEKO KAZUAKI (JP)
TAKAMURA TOMIO (JP)
HIRAYAMA TADASHI (JP)
IKEMURA YOSHIYUKI (JP)
TAMARU MASAHIKO (JP)

F25D1/02; F25D9/00; H01L21/00; H01L21/683; H02N13/00; (IPC1-7): H01L21/68; B21J5/00; B22F3/17; B22F3/24

JP2001223261A	2001-08-17
JP2000313905A	2000-11-14
JPH04333265A	1992-11-20
JPH08125002A	1996-05-17
EP0713250A2	1996-05-22
JP2001164304A	2001-06-19

Koyama, Yuu (5-7 Kojimach, Chiyoda-ku Tokyo, JP)

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