Title:
ELEMENT COMPRISING DIFFUSION PREVENTION STRUCTURE AND JUNCTION LAYER FORMED VIA ELECTROPLATING, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/169072
Kind Code:
A1
Abstract:
The present invention relates to an element comprising a diffusion prevention structure and a junction layer formed via electroplating, and a method for manufacturing same. More specifically, the present invention relates to an element comprising a diffusion prevention structure and a junction layer formed via electroplating, and a method for manufacturing same, which have an excellent junction performance, prevent peeling and cracking, and enable large-scale mass production at a low cost.
Inventors:
KIM SE-IL (KR)
RHA JONG-JOO (KR)
LEE JOO-YUL (KR)
LEE JU-YEONG (KR)
CHOA YONG-HO (KR)
RHA JONG-JOO (KR)
LEE JOO-YUL (KR)
LEE JU-YEONG (KR)
CHOA YONG-HO (KR)
Application Number:
PCT/KR2021/016054
Publication Date:
August 11, 2022
Filing Date:
November 05, 2021
Export Citation:
Assignee:
KOREA INSTITUTE OF MAT SCIENCE (KR)
International Classes:
H01L35/04; H01L35/16; H01L35/34
Foreign References:
| KR20180084711A | 2018-07-25 | |||
| JP2020155556A | 2020-09-24 | |||
| KR20200140015A | 2020-12-15 | |||
| KR20180022611A | 2018-03-06 | |||
| JP2016115866A | 2016-06-23 |
Attorney, Agent or Firm:
EZ INTERNATIONAL PATENT & TRADEMARK LAW OFFICE (KR)
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