ELEMENT-SEALING RESIN COMPOSITION FOR ORGANIC ELECTRONIC DEVICE, ELEMENT-SEALING RESIN SHEET FOR ORGANIC ELECTRONIC DEVICE, ORGANIC ELECTROLUMINESCENCE ELEMENT, AND IMAGE DISPLAY APPARATUS

WIPO Patent Application WO/2014/156324

A1

The present invention provides an element-sealing resin composition for an organic electronic device, an element-sealing resin sheet for the organic electronic device, an organic electroluminescence element, and an image display apparatus, the element-sealing resin composition for an organic electronic device balancing water-vapor barrier properties and adhesive strength, reducing water content, and adequately suppressing the occurrence of outgas, whereby as a result the service life of an element for an organic electronic device is extended and the outer appearance thereof when sealed is good. This element-sealing resin composition for an organic electronic device is characterized in containing a polyisobutylene resin (A) having a weight-average molecular weight (Mw) of 10,000-300,000, and a hydrogenated cyclic olefin polymer (B), the water content of the element-sealing resin composition being 500 ppm or less as measured by the Karl-Fischer method, and the amount of outgas produced when the element-sealing resin composition is heated at 85°C for one hour being 500 ppm or less.

JPS6059394	[Title of the device] EL
WO/2010/140980	MULTILAYER BARRIER FILM
JP6779061	Manufacturing methods for protective sheets, structures and organic devices

MIEDA TETSUYA (JP)
NAKAMURA TOSHIMITSU (JP)
ISHIGURO KUNIHIKO (JP)
AOYAMA MASAMI (JP)

PCT/JP2014/052843

October 02, 2014

February 07, 2014

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FURUKAWA ELECTRIC CO LTD (JP)

H05B33/04; C08L23/22; C08L45/00; G09F9/30; H01L27/32; H01L51/50

WO2013002288A1

2013-01-03

JP2012193335A	2012-10-11
JP2010080293A	2010-04-08
JP2011231313A	2011-11-17

MATSUSHITA, Makoto et al. (JP)
Matsushita 亮 (JP)

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