Title:
EMBEDDING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/171416
Kind Code:
A1
Abstract:
Provided is an embedding method for embedding a film in a recess of a substrate, the method comprising: (a) preparing a substrate having the recess on a placement stage disposed in a chamber of a substrate processing apparatus; (b) forming a flowable film in the recess; and (c) supplying an RF power to the placement stage to perform first modification on the flowable film by means of generated plasma.
Inventors:
GUNJI ISAO (JP)
OBA DAISUKE (JP)
IKUTA HIROYUKI (JP)
MORISADA YOSHINORI (JP)
OBA DAISUKE (JP)
IKUTA HIROYUKI (JP)
MORISADA YOSHINORI (JP)
Application Number:
PCT/JP2023/006750
Publication Date:
September 14, 2023
Filing Date:
February 24, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/31; C23C16/42; C23C16/56; H01L21/316; H01L21/318
Domestic Patent References:
WO1992012535A1 | 1992-07-23 |
Foreign References:
JPH07153702A | 1995-06-16 | |||
JP2011086965A | 2011-04-28 | |||
JP2020017698A | 2020-01-30 | |||
JPH04167431A | 1992-06-15 | |||
JP2021039975A | 2021-03-11 | |||
JP2014532304A | 2014-12-04 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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