Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
EMBEDDING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/171416
Kind Code:
A1
Abstract:
Provided is an embedding method for embedding a film in a recess of a substrate, the method comprising: (a) preparing a substrate having the recess on a placement stage disposed in a chamber of a substrate processing apparatus; (b) forming a flowable film in the recess; and (c) supplying an RF power to the placement stage to perform first modification on the flowable film by means of generated plasma.

Inventors:
GUNJI ISAO (JP)
OBA DAISUKE (JP)
IKUTA HIROYUKI (JP)
MORISADA YOSHINORI (JP)
Application Number:
PCT/JP2023/006750
Publication Date:
September 14, 2023
Filing Date:
February 24, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/31; C23C16/42; C23C16/56; H01L21/316; H01L21/318
Domestic Patent References:
WO1992012535A11992-07-23
Foreign References:
JPH07153702A1995-06-16
JP2011086965A2011-04-28
JP2020017698A2020-01-30
JPH04167431A1992-06-15
JP2021039975A2021-03-11
JP2014532304A2014-12-04
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: MIXED COMPOSITION AND LAYERED BODY

Next Patent: DISPENSER SYSTEM