Title:
EMBOSSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/065547
Kind Code:
A1
Abstract:
An embossing device (10) comprises an embossing mold (20) including a molding part (22) having recesses and protrusions. The molding part (22) contacts a surface of a base material (85). An emboss receiving mold (30) includes a resinous elastic part (32). The elastic part (32) contacts a rear surface of the base material (85). The molding part (22) has a height difference (ΔH) between the apex of a protruding part (24) and the bottom of a recessed part (26) as a first value. The elastic part (32) has a smooth surface forming an outer surface of the emboss receiving mold (30). The elastic part (32) has a thickness (T) in a direction perpendicular to the outer surface of the emboss receiving mold (30) as a second value greater than or equal to the first value. The embossing mold (20) and the emboss receiving mold (30) sandwich the base material (85) by means of the molding part (22) and the elastic part (32).
Inventors:
NAKAJIMA SHIGERU (JP)
Application Number:
PCT/JP2018/035233
Publication Date:
April 04, 2019
Filing Date:
September 22, 2018
Export Citation:
Assignee:
SEIREN CO LTD (JP)
International Classes:
B29C59/02; B29C33/40; D06N3/00
Foreign References:
| JP2004255462A | 2004-09-16 | |||
| JPS6255119A | 1987-03-10 |
Attorney, Agent or Firm:
KITAGAWA, Yasutaka (JP)
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