EMULSION COMPOSITION AND SOIL EROSION PREVENTION MATERIAL

Title:

EMULSION COMPOSITION AND SOIL EROSION PREVENTION MATERIAL

Document Type and Number:

WIPO Patent Application WO/2022/018919

Kind Code:

A1

Abstract:

Provided is a soil erosion prevention material that has high soil erosion prevention capability for farmland and well-balanced and improved strength and flexibility.　Provided is an emulsion composition that has a minimum film-forming temperature of -5°C to 10°C. The minimum film-forming temperature is the lowest temperature at which film formation is observed when an SUS plate of 2.0 mm × 50 mm × 125 mm is kept still at the minimum film-forming temperature for 3 hours, the emulsion composition is applied to a coating thickness of 0.2 mm to the SUS plate, and the SUS plate with the emulsion composition applied thereto is allowed to stand at the minimum film-forming temperature for 3 hours.

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Inventors:

TAKAHASHI JUNPEI (JP)
NISHINO KOHEI (JP)

Application Number:

PCT/JP2021/016043

Publication Date:

January 27, 2022

Filing Date:

April 20, 2021

Export Citation:

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Assignee:

DENKA COMPANY LTD (JP)

International Classes:

C09K17/18; C09K17/20

Domestic Patent References:

WO2016204290A1

2016-12-22

Foreign References:

JP2009013373A	2009-01-22
JPS59122623A	1984-07-16

Attorney, Agent or Firm:

SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)

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