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Patent Searching and Data


Title:
ENCAPSULATION FILM
Document Type and Number:
WIPO Patent Application WO/2023/101489
Kind Code:
A1
Abstract:
The present application relates to an encapsulation film, a manufacturing method therefor, an organic electronic device comprising same, and a method for manufacturing an organic electronic device by using same. The encapsulation film comprises an encapsulation layer, which is a cured product of an encapsulation composition, the encapsulation composition comprises an encapsulation resin and a moisture adsorbent, and the encapsulation layer is a single layer and comprises, in the thickness direction, a first region, a second region and a third region which have different concentrations of the moisture adsorbent, and thus moisture or oxygen can be blocked from entering, from the outside, the organic electronic device and the long-term reliability of the organic electronic device can be ensured.

Inventors:
SEO BEOM DOO (KR)
RYU JAE SEOL (KR)
CHOI KWANG HUI (KR)
YOON JHIN YEONG (KR)
RYU DONG HWAN (KR)
KIM YERN SEUNG (KR)
KIM KYUNG INN (KR)
KANG HO SUNG (KR)
Application Number:
PCT/KR2022/019412
Publication Date:
June 08, 2023
Filing Date:
December 01, 2022
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
International Classes:
H10K50/80; B29C48/08; C08J5/18; C08K3/013; C08L23/00
Foreign References:
KR20140136902A2014-12-01
JP3603428B22004-12-22
KR20150016922A2015-02-13
KR20200033816A2020-03-30
KR20190065662A2019-06-12
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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