Title:
ENCAPSULATION STRUCTURE AND PREPARATION METHOD FOR ENCAPSULATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/258536
Kind Code:
A1
Abstract:
Provided are an encapsulation structure and a preparation method for an encapsulation structure. The encapsulation structure comprises a first inorganic layer (101, 201), a first organic layer (102, 200) and a second inorganic layer (103), wherein an upper surface of the first organic layer (102, 200) is provided with a plurality of grooves, and an area, opposite the grooves, of a lower surface of the second inorganic layer (103) is provided with a plurality of protrusions. When a display panel is sealed, the protrusions extend into the grooves in a manner of corresponding one-to-one, the contact area between the organic layer and the inorganic layer is increased, an adhesive force between film layers is improved, and a display device is protected.
Inventors:
LI ZHAO (CN)
Application Number:
PCT/CN2019/106385
Publication Date:
December 30, 2020
Filing Date:
September 18, 2019
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L51/52; H01L51/56
Foreign References:
| CN109461830A | 2019-03-12 | |||
| CN109461830A | 2019-03-12 | |||
| US20150280167A1 | 2015-10-01 | |||
| CN108539041A | 2018-09-14 | |||
| CN109585677A | 2019-04-05 | |||
| CN205985076U | 2017-02-22 | |||
| CN109273507A | 2019-01-25 |
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
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