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Title:
ENCAPSULATION TECHNIQUES
Document Type and Number:
WIPO Patent Application WO/2021/240499
Kind Code:
A8
Abstract:
An integrated circuit (IC) assembly and a method for encapsulating of IC are presented. The IC assembly comprises an IC substrate having one or more micro-devices, at least one dielectric matrix element placed on said IC substrate over at least one of its one or more micro-devices; and an encapsulation element applied over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate.

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Inventors:
SHAPIR ITZHAK (IL)
KEDEM MICHAEL (IL)
Application Number:
PCT/IL2021/050532
Publication Date:
September 01, 2022
Filing Date:
May 11, 2021
Export Citation:
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Assignee:
ELTA SYSTEMS LTD (IL)
International Classes:
H05K9/00; H01L23/31
Attorney, Agent or Firm:
TAUBER, Gilad (IL)
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