Title:
ENDOSCOPE ADHESIVE AND CURED PRODUCT THEREOF, AND ENDOSCOPE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/070809
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an endoscope adhesive suitable for bonding members that constitute an endoscope, wherein the endoscope adhesive can maintain a satisfactory adhesive strength while in use for bonding members even when subjected to extended exposure to high temperatures and even when subjected to a strong sterilizing treatment such as ozone water. The present invention also addresses the problem of providing a cured product from the endoscope adhesive and providing an endoscope and a method for producing the same. The endoscope adhesive comprises an epoxy resin, an epoxy resin curing component, and a radical scavenger.
More Like This:
Inventors:
FURUKAWA KAZUSHI (JP)
NAKAI YOSHIHIRO (JP)
NAKAI YOSHIHIRO (JP)
Application Number:
PCT/JP2021/032923
Publication Date:
April 07, 2022
Filing Date:
September 08, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09J11/06; A61B1/00; C09J163/02; C09J163/04
Domestic Patent References:
| WO2020175278A1 | 2020-09-03 |
Foreign References:
| JP2006218102A | 2006-08-24 | |||
| JP2007161811A | 2007-06-28 | |||
| JP2014173007A | 2014-09-22 | |||
| JP2001115126A | 2001-04-24 | |||
| JP2012041421A | 2012-03-01 | |||
| JP2009256630A | 2009-11-05 | |||
| JP2002097442A | 2002-04-02 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
Download PDF: