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Patent Searching and Data


Title:
ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2019/187629
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an endoscope with high chemical resistance and easy wiring. In this endoscope, which is provided with an imaging device at the tip of an insertion unit that is inserted into a subject, the imaging device is provided with: a solid-state imaging element which has an image-receiving surface arranged crossing the longitudinal direction of the insertion unit and which photoelectrically converts the optical image formed on the image-receiving surface; a cable bundle which is provided with one or more coaxial cables connected to one or more connection terminals provided on the surface of the solid-state imaging element opposite of the image-receiving surface, and a common shield wire covering the outer periphery of the one or more coaxial cables; and a metal, pipe-shape member into which the cable bundle is inserted. The pipe-shape member has a notch in at least part of the peripheral surface, and at the end of the cable bundle on the side of the solid-state imaging element, at least one of the common shield wire and the shield wires of the one or more coaxial cables is bonded to the pipe-shape member in the notch of the pipe-shape member with soldering, metal brazing and/or metal paste.

Inventors:
SAKAMOTO TOSHIO (JP)
Application Number:
PCT/JP2019/003792
Publication Date:
October 03, 2019
Filing Date:
February 04, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
A61B1/04; A61B1/05; G02B23/24
Foreign References:
JP2012034947A2012-02-23
JP2013013666A2013-01-24
JP2003010111A2003-01-14
JPH11253385A1999-09-21
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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