Title:
ENERGY RAY-CURABLE FILM-SHAPED TRANSPARENT ADHESIVE, DEVICE COMPRISING SAME, AND DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/005071
Kind Code:
A1
Abstract:
Provided is an energy ray-curable film-shaped transparent adhesive comprising an epoxy resin, a phenoxy resin, and a photocationic polymerization initiator containing antimony at an anionic site. Also provided are a device comprising the film-shaped transparent adhesive, and a method for manufacturing the device using the film-shaped transparent adhesive.
Inventors:
SAKAI KOYUKI (JP)
TOKUHISA KENJI (JP)
TOKUHISA KENJI (JP)
Application Number:
PCT/JP2023/023974
Publication Date:
January 04, 2024
Filing Date:
June 28, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J11/04; C09J11/06; C09J163/00; C09J171/12
Domestic Patent References:
| WO2003106582A1 | 2003-12-24 |
Foreign References:
| JP2003253221A | 2003-09-10 | |||
| JP2002254660A | 2002-09-11 | |||
| JP2017504664A | 2017-02-09 | |||
| JP2007197617A | 2007-08-09 | |||
| JP2006233203A | 2006-09-07 | |||
| JP2018524426A | 2018-08-30 | |||
| JP2016171284A | 2016-09-23 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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