Title:
ENHANCED CONDUCTIVE PASTE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/227517
Kind Code:
A1
Abstract:
The present application relates to the technical field of new materials. Provided are an enhanced conductive paste and an electronic device. The enhanced conductive paste provided in the present application is composed of the following materials, in percentage by weight: 4%-20% of a resin, 4%-10% of a curing agent, 50%-80% of a conductive filler, 5%-35% of a reinforcing filler, 5%-25% of a solvent, and 0.05%-4% of an auxiliary, wherein the reinforcing filler comprises whiskers having a tensile strength not less than 1 GPa, a linear or fibrous reinforcement structure, and a metal layer that coats the reinforcement structure, the electrical conductivity of the metal layer being better than that of the reinforcement structure; and the length of the reinforcing filler ranges from 0.1 μm to 25 μm. By means of the technical solution of the present application, the adhesion strength between a conductive structure in an electronic device and a base material in same can be increased.
Inventors:
WANG HANJIE (CN)
REN ZHONGWEI (CN)
REN ZHONGWEI (CN)
Application Number:
PCT/CN2021/132447
Publication Date:
November 03, 2022
Filing Date:
November 23, 2021
Export Citation:
Assignee:
BEIJING DREAM INK TECH CO LTD (CN)
International Classes:
H01B1/22; H01B1/24
Domestic Patent References:
| WO2020180251A1 | 2020-09-10 |
Foreign References:
| CN113192663A | 2021-07-30 | |||
| CN102064328A | 2011-05-18 | |||
| CN106952677A | 2017-07-14 | |||
| CN106687515A | 2017-05-17 |
Attorney, Agent or Firm:
UNI-INTEL PATENT AND TRADEMARK LAW FIRM (CN)
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