Title:
ENHANCED INTEGRITY IMPLANTABLE SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO2004030514
Kind Code:
A3
Abstract:
A method and apparatus for enhancing the integrity of an implantable sensor. Voids formed between an outer tubing and a sensor substrate or spacing element may be back-filled with a curable, implantable material, minimizing the extent to which unwanted fluids diffuse within the sensor. An enzyme or protein matrix pellet below the sensor window may be pre-treated with a reducing agent to enhance its bond stability, and to reduce undesired swelling that may cause the sensor window to detach or leak. The bonding between the enzyme pellet and a hydrogel layer may be reinforced by application of an intervening bonding layer of a protein material, such as human serum albumin (HSA). The size of the window may be minimized by minimizing the size of an underlying electrode, providing reduced flux and lengthening sensor. A coating may be deposited on the surface of the sensor leads, providing stiffening and lubrication.
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Inventors:
SHAH RAJIV
ZHANG YANAN
GOTTLIEB REBECCA
REGHABI BAHAR
MILLER MICHAEL E
ZHANG YANAN
GOTTLIEB REBECCA
REGHABI BAHAR
MILLER MICHAEL E
Application Number:
PCT/US2003/028854
Publication Date:
October 07, 2004
Filing Date:
September 15, 2003
Export Citation:
Assignee:
MEDTRONIC MINIMED INC (US)
International Classes:
A61B5/00; (IPC1-7): A61B5/00; A61B5/05; G01N33/50; A61M5/00
Foreign References:
| US4730389A | 1988-03-15 | |||
| US6484045B1 | 2002-11-19 | |||
| US5039491A | 1991-08-13 | |||
| US5019096A | 1991-05-28 | |||
| US5957970A | 1999-09-28 |
Other References:
See also references of EP 1549209A4
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