Title:
EPISULFIDE GROUP-SUBSTITUTED SILICON COMPOUND AND THERMOSETTING RESIN COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2007/013396
Kind Code:
A1
Abstract:
Disclosed is an episulfide group-substituted silicon compound (A) having a backbone structure represented by the following formula (1). (1) (In the formula, R1s respectively represent a substituent having an episulfide group, an unsubstituted or unsaturated acyloxy group-substituted (C1-C10) alkyl group or an aryl group. R1s may be the same as or different from one another, but at least one R1 in a molecule is a substituent having an episulfide group.)
Inventors:
OCHI MITSUKAZU (JP)
NAKAYAMA KOJI (JP)
NAKAYAMA KOJI (JP)
Application Number:
PCT/JP2006/314569
Publication Date:
February 01, 2007
Filing Date:
July 24, 2006
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
OCHI MITSUKAZU (JP)
NAKAYAMA KOJI (JP)
OCHI MITSUKAZU (JP)
NAKAYAMA KOJI (JP)
International Classes:
C08G75/08
Foreign References:
| JP2005126589A | 2005-05-19 | |||
| JP2005092099A | 2005-04-07 | |||
| JP2004256609A | 2004-09-16 | |||
| JPH10324749A | 1998-12-08 | |||
| JP2003335842A | 2003-11-28 | |||
| JP2003261648A | 2003-09-19 | |||
| JP2003176332A | 2003-06-24 | |||
| JPH07196800A | 1995-08-01 |
Attorney, Agent or Firm:
ASAMURA, Kiyoshi et al. (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo 04, JP)
Download PDF: