Title:
EPOXY-BASED COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/186203
Kind Code:
A1
Abstract:
The present invention provides an epoxy-based composition that has excellent fluidity, low heat generation during curing, cures in a short time at room temperature, and can be used to obtain a cured product having excellent mechanical strength. An epoxy-based composition according to the present invention includes: 100 parts by weight of an epoxy resin (A) having an aromatic ring and an epoxy group in a molecule; a reactive amine compound (B) having a reaction rate constant k of 0.10-0.37 min-1 and including a polyamine (B1) and/or a polyamide amine (B2); and a catalyst compound (C) including a tertiary amine (C1) and/or a nitrogen-containing aromatic heterocyclic compound (C2), and having an integrated heat quantity of 100 J/g or more, a maximum heat flow of 0.08 W/g or more, and a temperature of 130°C or less indicating a maximum heat flow. The ratio of the amount of active hydrogen of the reactive amine compound (B) to the amount of epoxy of the epoxy resin (A) [the amount of active hydrogen of the reactive amine compound (B)/the amount of epoxy of the epoxy resin(A)] is 0.3-0.8.
Inventors:
SHIMAMURA KAZUYORI (JP)
Application Number:
PCT/JP2022/008615
Publication Date:
September 09, 2022
Filing Date:
March 01, 2022
Export Citation:
Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
C08G59/50; B01D63/02; C08G59/06; C08G59/54; C08L63/00
Domestic Patent References:
WO2016088528A1 | 2016-06-09 |
Foreign References:
JP2014118576A | 2014-06-30 | |||
JP2014517126A | 2014-07-17 | |||
JP2017171745A | 2017-09-28 | |||
JP2019151752A | 2019-09-12 | |||
JP2022035874A | 2022-03-04 |
Attorney, Agent or Firm:
YAMAMOTO, Takuya (JP)
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