Title:
EPOXY RESIN ADHESIVE FILM MATERIAL APPLIED TO SEMICONDUCTOR SYSTEM-LEVEL PACKAGING
Document Type and Number:
WIPO Patent Application WO/2024/045159
Kind Code:
A1
Abstract:
Disclosed in the present invention is an epoxy resin adhesive film material applied to semiconductor system-level packaging. The insulating adhesive film material consists of a lower carrier film, an intermediate dielectric film, and an upper covering film, wherein the dielectric film is located between the carrier film and the covering film to form a sandwich structure. The dielectric film is made from ethylene resin, a cross-linking agent, epoxy resin, a filler and the like, the high-frequency dielectric loss of a cured product is lower than 0.003, and the glass transition temperature is higher than 200°C.
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Inventors:
LUO SUIBIN (CN)
YU SHUHUI (CN)
YU JUNYI (CN)
XU PENGPENG (CN)
SUN RONG (CN)
YU SHUHUI (CN)
YU JUNYI (CN)
XU PENGPENG (CN)
SUN RONG (CN)
Application Number:
PCT/CN2022/116732
Publication Date:
March 07, 2024
Filing Date:
September 02, 2022
Export Citation:
Assignee:
SHENZHEN INST ADV TECH (CN)
International Classes:
H01B3/44; H01B3/30
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Attorney, Agent or Firm:
BEIJING CHENGHUI LAW FIRM (CN)
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