Title:
EPOXY RESIN-BASED CONDUCTIVE PASTE, PREPARATION METHOD THEREFOR, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/216490
Kind Code:
A1
Abstract:
The present application relates to the technical field of new materials, in particular to an epoxy resin-based conductive paste, a preparation method therefor, and the use thereof. The conductive paste comprises 9.6-30 wt% of an organic solvent; the conductive paste further comprises modified epoxy resin; the mass ratio of the modified epoxy resin to the organic solvent is (1-3):(2-6); and the viscosity of the modified epoxy resin at 25 ℃ is 10000-30000 cps. In the present application, by optimizing the formula and preparation process of the conductive paste, the conductive paste having both low resistance and high adhesive force is obtained. In addition, the conductive paste also has good printing performance. A coating layer or a conductive line prepared from the conductive paste has good conductivity, further has good flexibility, stretchability and wear resistance, and has excellent adhesive force on a surface of a base material and high reliability, thus satisfying the requirements of a flexible printed circuit board better.
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Inventors:
JI ZHENXING (CN)
REN ZHONGWEI (CN)
SHAO JINGYAN (CN)
REN ZHONGWEI (CN)
SHAO JINGYAN (CN)
Application Number:
PCT/CN2022/120153
Publication Date:
November 16, 2023
Filing Date:
September 21, 2022
Export Citation:
Assignee:
BEIJING DREAM INK TECH CO LTD (CN)
International Classes:
H01B13/00; H01B1/20; H05K1/09
Foreign References:
| CN114974651A | 2022-08-30 | |||
| CN114292384A | 2022-04-08 | |||
| CN112992404A | 2021-06-18 | |||
| CN114464344A | 2022-05-10 |
Attorney, Agent or Firm:
UNI-INTEL PATENT AND TRADEMARK LAW FIRM (CN)
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