Title:
EPOXY RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2019/087877
Kind Code:
A1
Abstract:
Provided are an epoxy resin composition which not only has high heat resistance and mechanical strength but also has excellent damping properties and a film or forming material comprising or obtained from the epoxy resin composition. The epoxy resin composition comprises the following components A to D. Component A, which is an epoxy resin having an oxazolidone ring structure in the molecule; component B, which is an epoxy resin that is liquid at 30°C; component C, which is a diblock copolymer having a B-M structure (where M is a block comprising either a homopolymer of methyl methacrylate or a copolymer including at least 50 wt% methyl methacrylate, B is a block which is incompatible with both the epoxy resins and block M and has a glass transition temperature Tg of 20°C or lower, and the blocks indicated by B and M have been bonded to each other directly or connected to each other by a linking group); and component D, which is an amine-based hardener that is dicyandiamide or a derivative thereof.
Inventors:
HATTORI KOICHI (JP)
Application Number:
PCT/JP2018/039416
Publication Date:
May 09, 2019
Filing Date:
October 24, 2018
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C08G59/20; C08F293/00; C08G59/50; C08L53/00; C08L63/00
Domestic Patent References:
| WO2016104314A1 | 2016-06-30 | |||
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| WO2017195304A1 | 2017-11-16 | |||
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| WO2012147401A1 | 2012-11-01 | |||
| WO2016132655A1 | 2016-08-25 | |||
| WO2016104314A1 | 2016-06-30 |
Foreign References:
| JP2010100834A | 2010-05-06 | |||
| JP2008007682A | 2008-01-17 | |||
| JP2007514872A | 2007-06-07 | |||
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Other References:
See also references of EP 3705508A4
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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