Title:
EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/239797
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition including an epoxy resin (A), a curing agent (B), an imidazole adduct type curing promoter (C), and a Lewis acid compound (D) having boron atoms or aluminum atoms, wherein: the curing agent (B) includes a compound (B-1) represented by formula (B-1) (where R1 represents a hydrogen atom, a halogen atom, a methoxy group, or a C1–12 hydrocarbon group); and the content of a compound (B-2) represented by formula (B-2) (where R2 represents a hydrogen atom, a halogen atom, a methyl group, or a methoxy group) in the curing agent (B) is at least 0 parts by mass and less than 2.0 parts by mass relative to 100 parts by mass of the epoxy resin (A).
Inventors:
TAKEUCHI KENICHI (JP)
KATO HIROFUMI (JP)
KATO HIROFUMI (JP)
Application Number:
PCT/JP2022/019934
Publication Date:
November 17, 2022
Filing Date:
May 11, 2022
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08G59/68
Foreign References:
| JP2020084050A | 2020-06-04 | |||
| JP2021036020A | 2021-03-04 | |||
| JP2012158730A | 2012-08-23 | |||
| JP2016169275A | 2016-09-23 | |||
| JP2015083634A | 2015-04-30 | |||
| JP2013032510A | 2013-02-14 | |||
| JPS5953526A | 1984-03-28 | |||
| JPS604524A | 1985-01-11 | |||
| JPS6072917A | 1985-04-25 | |||
| JP2005206744A | 2005-08-04 | |||
| JPH0673156A | 1994-03-15 | |||
| JPH06172495A | 1994-06-21 | |||
| JP2008214567A | 2008-09-18 | |||
| JP2014177525A | 2014-09-25 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF: