Title:
EPOXY RESIN, EPOXY RESIN COMPOSITION, AND EPOXY RESIN CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/149493
Kind Code:
A1
Abstract:
The present invention provides an epoxy resin that has favorable melt-kneadability, has solvent solubility, and is for use in layering, molding, casting, adhesion, or the like. The present invention also provides an epoxy resin composition and a cured product of the epoxy resin composition. According to the present invention, an epoxy resin is characterized by being an epoxy resin represented by general formula (1). (In the formula: X independently represents a direct bond, an oxygen atom, a sulfur atom, -SO2-, -CO-, -COO-, -CONH-, -CH2-, or -C(CH3)2-; A independently represents benzonitrile or -(CH2)m-, provided that at least one molecule has both structures; n is a number from 2 to 15; and m is a number from 3 to 10).
Inventors:
OMURA MASAKI (JP)
OGAMI KOICHIRO (JP)
SHRESTHA NIRANJAN KUMAR (JP)
OGAMI KOICHIRO (JP)
SHRESTHA NIRANJAN KUMAR (JP)
Application Number:
PCT/JP2023/003303
Publication Date:
August 10, 2023
Filing Date:
February 02, 2023
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C08G59/06
Domestic Patent References:
| WO2021201046A1 | 2021-10-07 | |||
| WO2012070590A1 | 2012-05-31 |
Foreign References:
| CN110305312A | 2019-10-08 | |||
| US20080142443A1 | 2008-06-19 | |||
| JP2023000691A | 2023-01-04 | |||
| JP2023033883A | 2023-03-13 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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