Title:
EPOXY RESIN COMPOSITION, ELECTRONIC COMPONENT MOUNTING STRUCTURE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/100934
Kind Code:
A1
Abstract:
The present invention further suppresses the occurrence of recess defects which are formed in a polished surface when a surface of a cured product of an epoxy resin composition is polished. Provided is an epoxy resin composition comprising (A) an epoxy resin, B) at least one component selected from the group consisting of curing agents and curing accelerators, and (C) a filler, wherein the average presence density of recesses which have a diameter of not less than 0.5 μm and which are observed in a polished surface of a cured product of the epoxy resin composition is not more than 1.00/mm2. Also provided are an electronic component mounting structure using the epoxy resin composition, and a method for producing the electronic component mounting structure.
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Inventors:
OE TAKAYUKI (JP)
SAITO YU (JP)
KAMIMURA TSUYOSHI (JP)
SAITO YU (JP)
KAMIMURA TSUYOSHI (JP)
Application Number:
PCT/JP2023/026781
Publication Date:
May 16, 2024
Filing Date:
July 21, 2023
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L63/00; C08G59/40; C08K3/013; C08K7/22; H01L21/56; H01L23/12; H01L23/29; H01L23/31
Domestic Patent References:
| WO2019124192A1 | 2019-06-27 | |||
| WO2018221682A1 | 2018-12-06 | |||
| WO2018225599A1 | 2018-12-13 | |||
| WO2019073763A1 | 2019-04-18 |
Foreign References:
| JP2005105243A | 2005-04-21 | |||
| JP2022113053A | 2022-08-03 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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