Title:
EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP MATERIAL, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/089878
Kind Code:
A1
Abstract:
[Problem] To provide an epoxy resin composition that has excellent injection properties and thermal conductivity for a cured product and can be used to produce a semiconductor device that has high operation reliability. [Solution] An epoxy resin composition that includes an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D). The epoxy resin composition is characterized by: the filler (D) including an aluminum nitride filler (D-1); the average particle size of the aluminum nitride filler (D-1) being no more than 10.0 μm; the uranium content in the aluminum nitride filler (D-1) being no more than 20 ppb; and the blending ratio of the aluminum nitride filler (D-1) to the total amount of filler (D) is at least 70% by mass.
Inventors:
SUZUKI MAKOTO (JP)
SAKAI YOSUKE (JP)
KAMIMURA TSUYOSHI (JP)
SAKAI YOSUKE (JP)
KAMIMURA TSUYOSHI (JP)
Application Number:
PCT/JP2022/030151
Publication Date:
May 25, 2023
Filing Date:
August 05, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L63/00; C08G59/18; C08K3/28; C08K3/36; H01L23/29; H01L23/31
Domestic Patent References:
| WO2014208352A1 | 2014-12-31 |
Foreign References:
| JP2011079973A | 2011-04-21 | |||
| JP2017110146A | 2017-06-22 | |||
| JP2006256913A | 2006-09-28 | |||
| JPH05170409A | 1993-07-09 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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