Title:
EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND USE OF COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/086368
Kind Code:
A1
Abstract:
Provided are an epoxy resin composition which can have a sufficiently low viscosity without using a diluent (organic solvent), and a method for producing the composition. Also provided are an epoxy resin composition which preferably has, when being cured, excellent electrical characteristics (particularly, a low permittivity and a low dielectric loss tangent), a high adhesion strength to metal, and excellent water absorption characteristics, and a method for producing the composition.
Inventors:
FUKUDA NORIAKI (JP)
HARISAKI RYOTA (JP)
YAMAMOTO KATSUMASA (JP)
NEMOTO NOBUKATSU (JP)
HARISAKI RYOTA (JP)
YAMAMOTO KATSUMASA (JP)
NEMOTO NOBUKATSU (JP)
Application Number:
PCT/JP2016/084031
Publication Date:
May 26, 2017
Filing Date:
November 17, 2016
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08L63/00; C08G59/30; C08K3/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2015041325A1 | 2015-03-26 |
Foreign References:
| JP2008505945A | 2008-02-28 | |||
| JP2010215858A | 2010-09-30 | |||
| JP2009544785A | 2009-12-17 | |||
| JP2012001668A | 2012-01-05 | |||
| JP2003321482A | 2003-11-11 | |||
| JP2004527602A | 2004-09-09 | |||
| JP2012162585A | 2012-08-30 | |||
| GB1123960A | 1968-08-14 |
Other References:
See also references of EP 3378897A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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