Title:
EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED-CIRCUIT BOARD COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2017/101538
Kind Code:
A1
Abstract:
Provided are an epoxy resin composition and a prepreg, laminated board and printed-circuit board comprising same. The epoxy resin composition comprises the following components: (A) 38-54 parts by weight of an epoxy resin comprising a DCPD structure; (B) 30-36 parts by weight of an active ester curing agent; and (C) 16-32 parts by weight of a cyanate resin. With the mutual cooperation and synergistic facilitation effects of the particular contents of the three essential components, the epoxy resin composition is obtained. Under the premise of having a high resistance to heat and humidity and a high heat resistance at the same time, the prepreg, laminated board and printed-circuit board made of the epoxy resin composition further have a low thermal expansion coefficient, a low water absorption rate and excellent dielectric properties.
Inventors:
ZENG XIANPING (CN)
HE LIEXIANG (CN)
XU HAOSHENG (CN)
HE LIEXIANG (CN)
XU HAOSHENG (CN)
Application Number:
PCT/CN2016/099127
Publication Date:
June 22, 2017
Filing Date:
September 14, 2016
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08G59/42; C07D519/00; C08G59/40; C08L63/00
Foreign References:
| CN105153234A | 2015-12-16 | |||
| CN103937157A | 2014-07-23 | |||
| CN102977551A | 2013-03-20 | |||
| JP2003131373A | 2003-05-09 | |||
| EP0347800A2 | 1989-12-27 |
Other References:
See also references of EP 3392286A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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