Title:
EPOXY RESIN COMPOSITION, PREPREG, EPOXY RESIN COMPOSITION MOLDED BODY, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/099194
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition capable of forming a cured product having excellent heat resistance, water absorption, modulus of elasticity, mechanical strength, and electrical reliability while securing curability at a low temperature, a prepreg making use of the epoxy resin composition, a molded body, and a cured product thereof. The epoxy resin composition contains an epoxy resin that is at least bifunctional, an aniline resin having a biphenylene novolac structure, and a protonic acid curing accelerator, wherein the content of the protonic acid curing accelerator is 0.01 to 10.0 parts by weight with respect to 100 parts by weight of the epoxy resin.
More Like This:
| WO/2006/013943 | CURABLE RESIN COMPOSITION, SHAPED ARTICLE AND METHOD FOR PRODUCING SAME |
| JP2023515315 | Amine epoxy resin adduct |
Inventors:
MATSUURA KAZUKI (JP)
NAKANISHI MASATAKA (JP)
NAKANISHI MASATAKA (JP)
Application Number:
PCT/JP2016/086628
Publication Date:
June 15, 2017
Filing Date:
December 08, 2016
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G59/50; C08G61/02; C08J5/24; C08L63/00; C08L65/00
Domestic Patent References:
| WO2015152007A1 | 2015-10-08 | |||
| WO2011068092A1 | 2011-06-09 |
Foreign References:
| JPS62232429A | 1987-10-12 | |||
| JPH02222413A | 1990-09-05 | |||
| JP2008208201A | 2008-09-11 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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